Base material

For the production of PCBs and their various scopes, it is important to choose the most suitable base material.

There is a wealth of material, whose parameters are crucial for different applications. The key factors of a base material are process safety, electrical, thermal and mechanical characteristics.

Here you can find a selection of our base materials:

FR4 standard materialcomposite material made of fibreglass fabric and epoxy resin binder,TG 135°C thicknesses: 0,1 – 3,2mm * from a thickness of 3,2mm, the material can be pressed, other thicknesses on demand
FR4 high TG materialfor applications with dynamic loads and high temperatures
FR4 – Flexlam materialparticularly thin, for the production of PCBs with flexible parts
FR4 filled with ceramicsceramic bonded materials
CAF resistant materialfor high thermal loads and circuits with high demands on migration solid substrates
Rogers materialceramic material, very high isolation resistance at low substrate thickness
IMS materialbase material for efficient derivation of dissipated heat
Polyimidethin and temperature resistant material for flexible PCBs
Teflonideal for high frequency applications

* other materials on request