Base material for PCB production

For the production of PCBs and their various scopes, it is important to choose the most suitable base material.

There is a wealth of material, whose parameters are crucial for different applications. The key factors of a base material are process safety, electrical, thermal and mechanical characteristics.

Here you can find a selection of our base materials:

FR4 standard material	composite material made of fibreglass fabric and epoxy resin binder,TG 135°C thicknesses: 0,1 – 3,2mm * from a thickness of 3,2mm, the material can be pressed, other thicknesses on demand
FR4 high TG material	for applications with dynamic loads and high temperatures
FR4 – Flexlam material	particularly thin, for the production of PCBs with flexible parts
FR4 filled with ceramics	ceramic bonded materials
CAF resistant material	for high thermal loads and circuits with high demands on migration solid substrates
Rogers material	ceramic material, very high isolation resistance at low substrate thickness
IMS material	base material for efficient derivation of dissipated heat
Polyimide	thin and temperature resistant material for flexible PCBs
Teflon	ideal for high frequency applications

* other materials on request

PCB manufacturing